The semiconductor packaging mold industry has strict and evolving requirements, driven by the continuous advancement of electronic products. As devices become more integrated and compact, the demand for high-end, miniaturized components has increased significantly. This trend has led to a higher requirement for mold precision and quality, as smaller package sizes and thinner structures necessitate greater accuracy in mold design and manufacturing.
Plastic molding is one of the most critical post-process techniques in semiconductor device production. It is widely used in single-cylinder packaging technology, covering a variety of packages such as DIP, SOP, QFP, SOT, SOD, discrete devices, chip tantalum capacitors, inductors, and bridge circuits. As packaging technologies evolve, chips are getting smaller, with the ratio of chip area to package area approaching 1. The number of I/Os is increasing, and pin pitches are becoming tighter, which requires advanced tooling equipment to meet these demands.
To keep up with these changes, innovative solutions like multi-injection mold packaging (MGP), automatic die-cutting systems, and automated packaging systems have emerged. These high-tech tools help improve efficiency, reduce errors, and ensure consistent product quality. Sanjia has introduced several of these cutting-edge products to support the industry's development.
Multi-injection head packaging (MGP) represents an evolution of traditional single-cylinder molds and is now the mainstream in modern packaging. This technology uses multiple injection heads and barrels, allowing for balanced flow channels, near-distance filling, and improved resin utilization. It ensures stable processes and high-quality packaging, making it ideal for complex packages like SSOP, TSSOP, LQFP, SOT, and SOD.
The automatic die-cutting system plays a crucial role in shaping integrated circuits and semiconductor devices. Its future lies in high-speed, multi-functional, and versatile operations that can adapt to various lead frame carrier designs. This system enhances productivity and flexibility in semiconductor manufacturing.
Looking ahead, the development of semiconductor packaging molds will focus on higher precision and speed, particularly in the field of automated packaging. The automatic plastic sealing system is a high-precision, fully automated solution for post-processing of ICs. It integrates multiple sealing units, each equipped with modular MGP technology, enabling seamless preparation, assembly, loading, packaging, unloading, cleaning, gluing, and collection within a single system.
These technologies have seen rapid development abroad, with innovations like film-covered packaging and advanced plastic packaging emerging to meet the needs of high-density, high-lead products. As microelectronics continues to advance, the application of post-sealing molding equipment is constantly improving, and automation has become a key trend in the industry.
As China's first listed company in the mold industry, Sanjia is committed to adopting world-leading technologies and accelerating the localization of electronic molds to better serve global market demands.
Nanoscale Ultra-Precision Single-Point Diamond CNC Turning Lathe
DJC-100A Ultra-Precision Single-Point Diamond Turning Lathe, equipped with independent patent technology of hydrostatic spindle, hydrostatic guide rail and processing software. For optical lens, infrared lens, mirror, precision mechanical parts and core. Can realize turning and milling by flying cutter two modes. Machine tool has two-axis, three-axis, four-axis function, machining caliber 0~200 mm.
The plane, cylinder, cone, sphere, aspherical surface, diffraction surface, Fresnel and free surface can be processed with the support of the proprietary software.
Ultra-Precision CNC Turning Lathe, Nanoscale Turning Lathe, Mirro Turning Lathe, Single-Point Diamond CNC Turning Lathe,Ultra-Precision Machinetools
JARRY CNC MACHINERY CO.,LTD , https://www.jarry-machinetool.com
![<?echo $_SERVER['SERVER_NAME'];?>](/template/twentyseventeen/skin/images/header.jpg)